can not see can not see can not see
     
  Home Corporate Products &
Technology
Manufacturing
& Capacity
Poly Plant Update Investor Relations News & Events Career     Contact Us
                                 Products        R&D      Product Research              
Products
R&D
       Strategy
       Equipment 
Product Research  
 
 
R&D
     Home  >  Product Research  >  R&D

      The technology center is absorbed in investigating new technology and new process, at the same time, organizing item group to tackle key problems of technology appeared form manufacture and improve process; In the technical innovation aspect, the center revolves the pure silicon material, crystal-silicon growth, big crystal ingot, great size silicon wafer, thin wafer, as well as the equipment domestic product to investigate.
      The technology center positively cooperate with leading domestic and foreign researches, do the scientific research using province, domestic and foreign universities, research institute's manpower and equipment resources. The company has signed the long-term cooperation agreement with Nanchang University and Shanghai Jiaotong University presently, and has set up the LDK naming laboratory in the school.

       At the same time, LDK and the overseas enterprise carry on the technical cooperation, introduces American GT Corporation the large-scale poly-crystal casting stove, the crucible spurts spreading machine, silicon material corrosion clearer; The Swiss HCT Corporation's squarer, wire saw squarer, slurry recovery system; German RENA Corporation's entire automatic silicon wafer clearer.     

   
 
The research of mixing stock technology:
Waste material recycling technology in semiconductor industry
The recycling use of broken silicon wafer
The use of P-N type doping material
   
 
The research of growing crystal technology:
Increasing ingot weight, form 240kg to 450kg
Shorten the growing crystal time from 60hours to 50hours.
Shorten cooling time using helium gas.
   
 

The research of cutting technology:
Increase the dimension of wafer from 125 to 156 to 210mm
Decrease the thickness of wafer from 270 to 240,220,200mm
Reduce the cutting loss using thinner wire saw.

 
 
 
Copyright 2008 LDK Solar. All rights reserved